A method and an apparatus for producing semiconductor devices in which a semiconductor wafer is adhered to an ultraviolet sensitive tape, the adhesion force of which decreases upon irradiation with ultraviolet rays, the ultraviolet sensitive tape being adhered to a ring frame so that the semiconductor...http://www.google.es/patents/US5238876?utm_source=gb-gplus-sharePatente US5238876 - Method of dividing semiconductor wafer using ultraviolet sensitive tape
Method of dividing semiconductor wafer using ultraviolet sensitive tape
