A Chemical-Mechanical Polish (CMP) planarizing method and a Chemical-Mechanical Polish (CMP) slurry composition for Chemical-Mechanical Polish (CMP) planarizing of copper metal and copper metal alloy layers within integrated circuits. There is first provided a semiconductor substrate having formed upon...http://www.google.es/patents/US5863307?utm_source=gb-gplus-sharePatente US5863307 - Method and slurry composition for chemical-mechanical polish (CMP) planarizing of copper containing conductor layers
Method and slurry composition for chemical-mechanical polish (CMP ...
