A high density, non-bussed semiconductor package and a full body gold (FBG) method for manufacturing semiconductor packages are provided to improve electrical and mechanical connections with semiconductors and other electronic components and devices. The semiconductor package is fabricated by developing...http://www.google.es/patents/US6420207?utm_source=gb-gplus-sharePatente US6420207 - Semiconductor package and enhanced FBG manufacturing
Semiconductor package and enhanced FBG manufacturing
