An integrated circuit may be coupled to a printed circuit board through a split socket. The integrated circuit may be packaged with a package substrate electrically coupled to a socket which, in turn, is electrically coupled to a printed circuit board. Between the printed circuit board and the package...http://www.google.es/patents/US7517228?utm_source=gb-gplus-sharePatente US7517228 - Surface mounted micro-scale springs for separable interconnection of package substrate and high-speed flex-circuit
Surface mounted micro-scale springs for separable interconnection of package ...
