Temperature variations across the surface of a semiconductor wafer (12), having at least one major surface thereof exposed to a source of radiant heat energy (18), are reduced by positioning a reflective ring (30, 30', 30" or 30'") proximate the wafer edge (28). The reflective ring (30, 30', 30" or 30'")...http://www.google.es/patents/US4560420?utm_source=gb-gplus-sharePatente US4560420 - Method for reducing temperature variations across a semiconductor wafer during heating
Method for reducing temperature variations across a semiconductor wafer ...
