A BGA package and a method of fabricating the BGA package is provided. The package includes a substrate having a first surface with a pattern of conductors thereon, and an opposing second surface with a die attach area thereon. A first solder mask is formed on the first surface with via openings to ball...http://www.google.es/patents/US6825569?utm_source=gb-gplus-sharePatente US6825569 - BGA package having substrate with patterned solder mask defining open die attach area
BGA package having substrate with patterned solder mask defining open die ...
