Packaged microelectronic devices and methods for assembling microelectronic devices are disclosed herein. In one embodiment, a method of assembling a microelectronic device having a die and an interposer substrate includes depositing a solder ball onto a ball-pad on the interposer substrate and molding...http://www.google.es/patents/US6924550?utm_source=gb-gplus-sharePatente US6924550 - Packaged microelectronic devices and methods for assembling microelectronic devices
Packaged microelectronic devices and methods for assembling microelectronic ...
