Method for implementing a multi-phase plastic package for electronic components, and packaged electronic components produced according to the method. The present invention contemplates the use of molding compounds having two or more discrete phases in a transfer molding process wherein a temperature...http://www.google.es/patents/US6091157?utm_source=gb-gplus-sharePatente US6091157 - Method to improve internal package delamination and wire bond reliability using non-homogeneous molding compound pellets
Method to improve internal package delamination and wire bond reliability ...
