The present invention is concerned with a miniature microdevice package and a process of making thereof. The package has a miniature frame substrate made of a material selected from the group including: ceramic, metal and a combination of ceramic and metal. The miniature frame substrate has a spacer...http://www.google.es/patents/US7077969?utm_source=gb-gplus-sharePatente US7077969 - Miniature microdevice package and process for making thereof
Miniature microdevice package and process for making thereof
