One or two, or more, additional conductive layers, separated from one another (if two or more) and separated from a patterned (signal) conductive layer are formed in a flexible substrate, for mounting a semiconductor die in a semiconductor device assembly. These additional layers...http://www.google.es/patents/US5681777?utm_source=gb-gplus-sharePatente US5681777 - Process for manufacturing a multi-layer tab tape semiconductor device
Process for manufacturing a multi-layer tab tape semiconductor device
