A semiconductor package with build-up layers formed on a chip and a fabrication method of the semiconductor package are provided. A chip with a plurality of conductive bumps formed on bond pads thereof is received within a cavity of a carrier, and a dielectric layer encapsulates the conductive bumps...http://www.google.es/patents/US20070158861?utm_source=gb-gplus-sharePatente US20070158861 - Method for fabricating semiconductor package with build-up layers formed on chip
Method for fabricating semiconductor package with build-up layers formed on chip
Número de solicitud: 11/713,362 Número de publicación: US 2007/0158861 A1 Fecha de presentación: 1 Mar 2007 Patente emitida: US7629199 ( Fecha de emisión 8 Dic 2009)
