A method and system for forming contacts on semiconductor components, such as wafers, dice and packages, are provided. The method employs magnets to align and hold ferromagnetic balls on bonding sites of a component substrate. The system includes a holder for holding the component substrate, and magnets...http://www.google.es/patents/US6186392?utm_source=gb-gplus-sharePatente US6186392 - Method and system for forming contacts on a semiconductor component by aligning and attaching ferromagnetic balls
Method and system for forming contacts on a semiconductor component by ...
