A process for treating a copper or copper alloy substrate surface with a composition and corrosion inhibitor solution to minimize defect formation and surface corrosion, the method including applying a composition including one or more chelating agents, a pH adjusting agent to produce a pH between about...http://www.google.es/patents/US20010015345?utm_source=gb-gplus-sharePatente US20010015345 - Planarized copper cleaning for reduced defects
Número de solicitud: 09/727,133 Número de publicación: US 2001/0015345 A1 Fecha de presentación: 29 Nov 2000 Patente emitida: US7104267 ( Fecha de emisión 12 Sep 2006)
