A microelectronic assembly can include a first microelectronic device and a second microelectronic device. Each microelectronic device has a die structure including at least one semiconductor die and each of the microelectronic devices has a first surface, a second surface remote from the first surface...http://www.google.es/patents/US20090316378?utm_source=gb-gplus-sharePatente US20090316378 - Wafer level edge stacking
