A semiconductor package including plural semiconductor chips, and a wire bonding step for electrically interconnecting the semiconductor chips, are disclosed. In an exemplary method, a substrate is provided. Conductive circuit patterns are provided outside of a chip mounting region of the substrate,...http://www.google.es/patents/US6642610?utm_source=gb-gplus-sharePatente US6642610 - Wire bonding method and semiconductor package manufactured using the same
Wire bonding method and semiconductor package manufactured using the same
