A method of making a multiple 3-dimensional semiconductor device substrate includes the steps of providing a plurality of devices each device including a semiconductor die and having a reference face requiring a subsequent face processing. The reference face of each of the plurality of devices is positioned...http://www.google.es/patents/US5904502?utm_source=gb-gplus-sharePatente US5904502 - Multiple 3-dimensional semiconductor device processing method and apparatus
Multiple 3-dimensional semiconductor device processing method and apparatus
