A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost. Fabrication of 3DS memory...http://www.google.es/patents/US7705466?utm_source=gb-gplus-sharePatente US7705466 - Three dimensional multi layer memory and control logic integrated circuit structure
Three dimensional multi layer memory and control logic integrated circuit ...
