The invention concerns a carrier for Integrated Circuits (ICs). The ICs are carried by a multi-layer board, constructed of individual layers. Some layers carry conductive traces, and the traces are connected together to form a 3-dimensional network connecting the ICs. The individual layers are constructed...http://www.google.es/patents/US5303119?utm_source=gb-gplus-sharePatente US5303119 - Interconnection system for integrated circuits
