A dicing saw blade assembly with parallel blades separated by a spacer and attached to a single spindle on an automated dicing saw, is applicable to precisely separating CSP or MCM devices which have been fabricated on a polymeric substrate. Two parallel cuts are made simultaneously in the scribe streets...http://www.google.es/patents/US6413150?utm_source=gb-gplus-sharePatente US6413150 - Dual dicing saw blade assembly and process for separating devices arrayed a substrate
Dual dicing saw blade assembly and process for separating devices arrayed a ...
