A method for forming a microelectronic assembly is provided. A carrier substrate (30) is provided. A sacrificial layer (38) is formed over the carrier substrate. A polymeric layer (40), including a polymeric tape (42) and a polymeric layer adhesive (44), is formed over the sacrificial layer. The polymeric...http://www.google.es/patents/US20080182363?utm_source=gb-gplus-sharePatente US20080182363 - METHOD FOR FORMING A MICROELECTRONIC ASSEMBLY INCLUDING ENCAPSULATING A DIE USING A SACRIFICIAL LAYER
METHOD FOR FORMING A MICROELECTRONIC ASSEMBLY INCLUDING ENCAPSULATING A DIE ...
