A porous polishing pad is useful for polishing semiconductor substrates. The porous polishing pad has a porous matrix formed from a coagulated polyurethane and a non-fibrous polishing layer. The non-fibrous polishing layer has a polishing surface with a pore count of at least 500 pores per mm2 that decreases...http://www.google.es/patents/US20050026552?utm_source=gb-gplus-sharePatente US20050026552 - Porous polyurethane polishing pads
Número de solicitud: 10/630,255 Número de publicación: US 2005/0026552 A1 Fecha de presentación: 30 Jul 2003 Patente emitida: US6899602 ( Fecha de emisión 31 May 2005)
