A three dimensional thin-film interconnector is fabricated by depositing a dielectric layer onto the surface of a substrate, depositing a layer of conductive material onto the dielectric layer to form a signal plane, depositing a dielectric layer onto the surface of the signal plane, forming a plurality...http://www.google.es/patents/US5419038?utm_source=gb-gplus-sharePatente US5419038 - Method for fabricating thin-film interconnector
