A stacked microelectronic assembly comprises a plurality of subassemblies including folded substrates and at least one microelectronic element. The subassemblies are stacked substantially vertically. ...http://www.google.es/patents/US20030168725?utm_source=gb-gplus-sharePatente US20030168725 - Methods of making microelectronic assemblies including folded substrates
Methods of making microelectronic assemblies including folded substrates
Número de solicitud: 10/281,550 Número de publicación: US 2003/0168725 A1 Fecha de presentación: 28 Oct 2002 Patente emitida: US7149095 ( Fecha de emisión 12 Dic 2006)
