Multiple fully buffered DIMM circuits or instantiations are presented in a single module. In a preferred embodiment, memory integrated circuits (preferably CSPs) and accompanying AMBs are arranged in two ranks in two fields on each side of a flexible circuit. The flexible circuit has expansion contacts...http://www.google.es/patents/US20060050497?utm_source=gb-gplus-sharePatente US20060050497 - Buffered thin module system and method
