A method of producing a cavity package semiconductor device is disclosed. The method includes providing a bar pad having a plurality of bar pad straps, each strap extending outwardly from the outer edge of the bar pad and spaced about the edge of the bar pad; mounting integrated circuits having bond...http://www.google.es/patents/US4874722?utm_source=gb-gplus-sharePatente US4874722 - Process of packaging a semiconductor device with reduced stress forces
Process of packaging a semiconductor device with reduced stress forces
