In a copper plating process, a seed layer is uniformly deposited over a surface, including lining a high aspect ratio trench defined by that surface. A mask layer is provided using a process that fails to deposit in the trench. In one exemplary embodiment, the failure is due to the decrease in the isotropic...http://www.google.es/patents/US7109112?utm_source=gb-gplus-sharePatente US7109112 - Method of providing a structure using self-aligned features
Method of providing a structure using self-aligned features
