A wafer-level package includes a semiconductor wafer having at least one semiconductor chip circuit forming region each including a semiconductor chip circuit each provided with test chip terminals and non test chip terminals, at least one external connection terminal, at least one redistribution trace...http://www.google.es/patents/US6228684?utm_source=gb-gplus-sharePatente US6228684 - Wafer-level package, a method of manufacturing thereof and a method of manufacturing semiconductor devices from such a wafer-level package
Wafer-level package, a method of manufacturing thereof and a method of ...
