A method for making micro-electromechanical system devices includes: (a) forming a sacrificial layer on a device wafer; (b) forming a plurality of loop-shaped through-holes in the sacrificial layer so as to form the sacrificial layer into a plurality of enclosed portions; (c) forming a plurality of cover...http://www.google.es/patents/US7824945?utm_source=gb-gplus-sharePatente US7824945 - Method for making micro-electromechanical system devices
Method for making micro-electromechanical system devices
