In one embodiment, a method for depositing a material on a substrate is provided which includes positioning a substrate containing a contact within a process chamber, exposing the substrate to at least one pretreatment step and depositing a fill the contact vias by an electroless deposition process....http://www.google.es/patents/US20060252252?utm_source=gb-gplus-sharePatente US20060252252 - Electroless deposition processes and compositions for forming interconnects
Electroless deposition processes and compositions for forming interconnects
