The present invention is a method for bonding gold wire to gold bond pads at temperatures lower than 125 degrees Celsius, and more particularly at room temperature, defined to be 25 degrees Celsius. By applying compressive force and ultrasonic energy, an intermetallic bond can be formed between a gold...http://www.google.es/patents/US6698646?utm_source=gb-gplus-sharePatente US6698646 - Room temperature gold wire bonding
