Some embodiments provide surface mount devices that include a first electrode comprising a chip carrier part, a second electrode disposed proximate to the chip carrier part, and a casing encasing a portion of the first and second electrodes. The first electrode can extend from the chip carrier part toward...http://www.google.es/patents/US7635915?utm_source=gb-gplus-sharePatente US7635915 - Apparatus and method for use in mounting electronic elements
Apparatus and method for use in mounting electronic elements
