A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip-on-board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections which are column-like structures. The electric...http://www.google.es/patents/US6404044?utm_source=gb-gplus-sharePatente US6404044 - Semiconductor package with stacked substrates and multiple semiconductor dice
Semiconductor package with stacked substrates and multiple semiconductor dice
