The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component mounted to a substrate. The substrate carries...http://www.google.es/patents/US7095122?utm_source=gb-gplus-sharePatente US7095122 - Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same
Reduced-dimension microelectronic component assemblies with wire bonds and ...
