A matched set of integrated circuit chips (74, 78) and a method for assembling such integrated circuit chips (74, 78) into a matched set are disclosed. A first semiconductor wafer (62) having a plurality of integrated circuit chips (74) of a first type and a second semiconductor wafer (64) having a plurality...http://www.google.es/patents/US6483330?utm_source=gb-gplus-sharePatente US6483330 - Method for selecting components for a matched set using wafer interposers
Method for selecting components for a matched set using wafer interposers
