A multi-chip module (MCM) assembly has three stacked integrated circuit (IC) layers. The first IC layer is electrically flip-chip connected to a substrate. The back of the second IC layer may be glued to the back of the first IC layer, and the second and third IC layers are electrically flip-chip connected...http://www.google.es/patents/US6133626?utm_source=gb-gplus-sharePatente US6133626 - Three dimensional packaging configuration for multi-chip module assembly
Three dimensional packaging configuration for multi-chip module assembly
