An IC chip 1 is a flip chip type, which defines a main surface as a mounting surface that is externally exposed and is provided with external terminals 15 on pads 14. An IC chip 2 within a sealant member 6 is stacked on a rear surface of the IC chip 1 through an insulation adhesive member 3. A wiring...http://www.google.es/patents/US6424050?utm_source=gb-gplus-sharePatente US6424050 - Semiconductor device
