The invention includes a method of forming semiconductor circuitry wherein a first semiconductor structure comprising a first monocrystalline semiconductor substrate is bonded to a second semiconductor structure comprising a second monocrystalline semiconductor substrate. The first semiconductor substrate...http://www.google.es/patents/US6887753?utm_source=gb-gplus-sharePatente US6887753 - Methods of forming semiconductor circuitry, and semiconductor circuit constructions
Methods of forming semiconductor circuitry, and semiconductor circuit ...
