A method is disclosed for reducing the effects of buckling, also referred to as cracking or wrinkling in multilayer heterostructures. The present method involves forming a planarization layer superjacent a semiconductor substrate. A barrier film having a structural integrity is formed superjacent the...http://www.google.es/patents/US7485961?utm_source=gb-gplus-sharePatente US7485961 - Approach to avoid buckling in BPSG by using an intermediate barrier layer
Approach to avoid buckling in BPSG by using an intermediate barrier layer
