In a BGA type semiconductor device wherein, while leaving a via hole for a solder ball, an insulating film formed of a photosolder resist (PSR) is provided on a tape substrate on its side where a wiring pattern is provided, a groove portion is provided between a bonding wire sealing portion and the via...http://www.google.es/patents/US20020171145?utm_source=gb-gplus-sharePatente US20020171145 - BGA type semiconductor device, tape carrier for semiconductor device, and semiconductor device using said tape carrier
BGA type semiconductor device, tape carrier for semiconductor device, and ...
Número de solicitud: 10/000,791 Número de publicación: US 2002/0171145 A1 Fecha de presentación: 4 Dic 2001 Patente emitida: US6818989 ( Fecha de emisión 16 Nov 2004)
