The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In a preferred embodiment in accordance with the invention, a form standard associated with one or more CSPs provides a physical form that allows many of the varying...http://www.google.es/patents/US20040201091?utm_source=gb-gplus-sharePatente US20040201091 - Stacked module systems and methods
Número de solicitud: 10/836,855 Número de publicación: US 2004/0201091 A1 Fecha de presentación: 30 Abr 2004 Patente emitida: US7371609 ( Fecha de emisión 13 May 2008)
