Method and apparatus are disclosed for mounting a flexible film semiconductor chip carrier on a second level electronic package. The resulting electronic packaging structure includes electrically conductive spacers, such as solder balls or solder coated copper balls, which electrically interconnect outer...http://www.google.es/patents/US5159535?utm_source=gb-gplus-sharePatente US5159535 - Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
Method and apparatus for mounting a flexible film semiconductor chip carrier ...
