A method for increasing integrated circuit density comprising stacking an upper wafer and a lower wafer, each of which have fabricated circuitry in specific areas on their respective face surfaces. The upper wafer is attached back-to-back with the lower wafer with a layer of adhesive applied over the...http://www.google.es/patents/US6784023?utm_source=gb-gplus-sharePatente US6784023 - Method of fabrication of stacked semiconductor devices
Method of fabrication of stacked semiconductor devices
