A defect-position identifying method for a semiconductor substrate comprises the steps of: forming at least three reference points on a semiconductor substrate; detecting the reference points and a defect on the semiconductor substrate by means of a first evaluating system, which is provided for evaluating...http://www.google.es/patents/US6320655?utm_source=gb-gplus-sharePatente US6320655 - Defect-position identifying method for semiconductor substrate
Defect-position identifying method for semiconductor substrate
