An package such as an optocoupler package is disclosed. The optocoupler package includes a leadframe structure comprising a first die attach pad comprising a first die attach pad surface and a second die attach pad with a second die attach pad surface. The optocoupler package further has an optical emitter...http://www.google.es/patents/US20090140266?utm_source=gb-gplus-sharePatente US20090140266 - PACKAGE INCLUDING ORIENTED DEVICES
