A wafer edge grinding machine including a chuck rotatable about a first axis, a chuck basin having bottom and side walls surrounding the chuck and a fine aligner disposed over an open top of the basin and configured to deliver wafers to the chuck. The machine further includes a probe having a sensor...http://www.google.es/patents/US6000998?utm_source=gb-gplus-sharePatente US6000998 - System for calibrating wafer edge-grinder
