A control signal applied to a lead terminal is transmitted to metal wires and bonding pads. The control signal arriving at the bonding pads are provided at high speed from the lead terminal to the input nodes of input buffer circuits via interconnection layers with almost no difference in the...http://www.google.es/patents/US5801451?utm_source=gb-gplus-sharePatente US5801451 - Semiconductor device including a plurality of input buffer circuits receiving the same control signal
Semiconductor device including a plurality of input buffer circuits ...
