Metal nitride and metal oxynitride extrusions often form on metal silicides. These extrusions can cause short circuits and degrade processing yields. The present invention discloses a method of selectively removing such extrusions. In one embodiment, a novel wet etch comprising an oxidizing agent and...http://www.google.es/patents/US7211200?utm_source=gb-gplus-sharePatente US7211200 - Manufacture and cleaning of a semiconductor
