An encapsulated circuit assembly and a method for making an encapsulated circuit assembly are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a heat transfer device. The second printed circuit board comprises a heatsink, and the heat transfer device...http://www.google.es/patents/US6304450?utm_source=gb-gplus-sharePatente US6304450 - Inter-circuit encapsulated packaging
