A system for performing chemical mechanical polishing wherein a dopant is added to the slurry during a chemical mechanical planarization so as to enhance end point determination. In one embodiment the CMP system includes a laser end point detection system that provides a signal indicative of the intensity...http://www.google.es/patents/US6287879?utm_source=gb-gplus-sharePatente US6287879 - Endpoint stabilization for polishing process
