A monolithic Multi-chip Module (MCM) package includes two or more individual CAM dice mounted on a substrate formed as, for example, a plastic ball grid array (PBGA) package. The substrate includes an interconnect structure to route signals between corresponding pads of the CAM dice and balls of the...http://www.google.es/patents/US6521994?utm_source=gb-gplus-sharePatente US6521994 - Multi-chip module having content addressable memory
Multi-chip module having content addressable memory
